The "strongest middle range" mother for Ryzen is born.The power supply circuit at the top and the huge heat sink is enough!
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MSI "MPG X570S Carbon Max Wifi" TEXT by Hisayoshi Ishikawa is also attractive with chic and heavy monotone design.
The latest X570 mother with the name "X570S" is an "evolution -type X570" product that has the chipset itself as it is, raised the function as a motherboard to the latest trend, and performs detailed refinations.The “X570S” mother is appearing one after another from each company, but in this paper, I will introduce one of the three products that MSI released this fall, “MPG X570S Carbon Max WiFi”.
Fusion of carbon design with high -performance heat sinks
The coloring of the MPG X570S Carbon Max WiFi is accented to each part using gray -black heat sinks on the black substrate and silver plating.Compared to the lower "MAG X570s TOMAHAWK MAX WiFi" introduced in this review, the armor has increased, and the overall impression has increased.
広範囲を覆うヒートシンクが特徴的The VRM heat sink has adopted a classic large aluminum heat sink in the recent MSI motherboard.The difference from MAG X570S Tomahawk Max WiFi is that the two heat sinks on the left, the top of the top are connected by the heat pipe.Two heat sinks are heated to increase heat dissipation efficiency.In the MAG series, the heat sink on the left of the socket is simple, while the MPG X570S Carbon Max Wifi adds a carbon pattern panel.And the elaborate production, such as punching in the upper half and preparing a dragon emblem underneath, is also good.
薄いパネルを1枚加え、カーボンらしさを演出しているChipset Heat Sink has become a standard fanless structure for the "X570S" generation, and this product is not equipped with fans.Only the M.2 heat sink at the top tier has changed the design, but the chip set heat sink, the middle stage M.2 heat sink on the left, and the lower M.2 heat sink are expanding the heat dissipation area by digging a diagonal streak.And these heat sinks look flat at first glance, but they are very round.This changes slightly and looks three -dimensional when exposed to light.It is a design that makes you feel a little commitment.
チップセットヒートシンクは写真右部分で角度を変え、やや丸みを持たせていることで陰影に変化を加えているAn improved DRPS power supply circuit design composed of 14 + 2 phase configuration, 75A compatible MOSFET
The power supply circuit is also used one higher design.In addition to the enhancements of the 14 + 2 phase than the MAG grade, the company adopts a design called "Duet Rail Power System" (DRPS).
ヒートシンクを外すと、アッパーミドルらしい回路設計や拡張性が見えてくるIn the case of a high -end model, one MOSFET is connected to one channel on the PWM controller, which is generally called a direct phase.However, the PWM controller, which can control more than 10 phases, is a high -performance high -end product, so a method of connecting two Mosfet to one channel under the middle range is taken.In the past, the image of the usual phase dulver was the top, and the mosfet was arranged in parallel without using phase d'blas.
The MPG X570S CARBON MAX WiFi is a product with an upper middle in the MSI lineup, but does not use phase dubler for VRM.However, it is not a direct phase, but a two -channel of the PWM controller is connected in parallel.On the other hand, MAG X570S Tomahawk Max WiFi, which is lower than this unit, is a Mirrored Power Arrangement (MPA) that uses phase d'Acrangement (MPA).In other words, in the case of a conventional power supply circuit, the MPG series uses MPA and the MAG series uses DRPS, but it is actually reversed.
VRM部分の基板裏を見ても確かにフェーズダブラーはないAccording to MSI, the DRPS of MPG X570S Carbon Max Wifi is DRPS that has been improved from conventional designs.It is said that the improvement has achieved higher efficiency than MPA using phase d'Abler.It is said that it is well followed by a boost -like behavior when the CPU load is performed high, and it can bring out more performance.It doesn't seem to be so simple, as if you don't use phase d'blas = you can reduce costs, but use a phase dubler in the MAG series that requires more costs.
Let's look at VRM in detail in parts.The PWM controller uses a combination of Renesus "ISL69247", and MOSFET has a combination of Renesas's Smart Power Stage "RAA220075".The ISL69247 is a PWM controller that is often used in this grade.On the other hand, RAA220075 also supports the large output of 75A, and often see recruitment examples from middle to high ends.
PWMコントローラはルネサス（Intersil）「ISL69247」MOSFETはルネサスのSmart Power Stage「RAA220075」If you compare the power supply circuit between the company and the MPG grade and MAG grade, the circuit design called DRPS vs. MPA is first different, then the number of phases is 14 + 2 phase (MPG X570s Carbon Max Wifi) vs. 12 + 2 phases, and MOSFET is 75A compatible.It is different in terms of 60A compatible.In terms of efficiency and followability, the MPG grade is a power supply circuit design on one above whether it is a power supply power (or load dispersion), and it is safe for a gachi gamer who enjoys the latest weight title for a long time rather than a casual gamer.Isn't it a design?
When the Multi-CPU test of the Cinebench R23 is executed for 10 minutes, the temperature is 36.5 to 41 ° C for VRM and 38 to 41 ° C for the chipset (chipset connection side M.2 slot is installed on the M.2 slot, but it is Cinebench.(Small), M.2 SSD was a value of 34-38 ° C.In particular, the temperature rise of the VRM part is small, and the temperature is declining immediately after the test.It is said that a large heat sink, and a thermal pad with a heat pipe and a thermal pad that is 7W/MK is a more high -performance product.It is a design with a sense of security even in long game play.
CINEBENCH R23実行中の各部温度の推移（10分実行後、5分放置）| CPU | AMD Ryzen 7 4750G（8コア16スレッド） |
| メモリ | DDR4-3200 16GB（8GB×2） |
| グラフィックス機能 | Ryzen 7 4750G内蔵Radeon Graphics |
| SSD | M.2 SSD（PCI Express 3.0 x4、512GB） |
| CPUクーラー | 24cmクラスラジエータ搭載簡易水冷 |
| OS | Windows 10 Pro 64bit |
| 室温 | 26℃ |
Upper middle specification interface, especially abundant M.2 slots
The expansion slot is PCI Express X16 × 2, PCI Express X1 × 2.The X16 slot is 16 lanes in the upper row and 4 lanes in the lower row.Recent ATX motherboards have a high -speed interface bite of PCI Express lanes and a place with M.2 slots, and it is generally about four PCI Express slots.The MPG X570S CARBON MAX WiFi has three M.2 slots between the CPU socket and the upper x16 slot, and three M.2 slots between the upper and lower X16 slots.The number of M.2 slots is abundant, but the base plate looks quite cramped.
There are several restrictions on the operation of each PCI Express slot, M.2 slot, and Serial ATA interface, the lower x16 slot and the fourth M.2 slot are exclusive use of the PCI Express lane, the third M.2 slot.When using, if the M.2 SSD of the PCI Express connection is inserted there, Serial ATA No. 5 and No. 6 are used if the M.2 SSD of the serial ATA connection is inserted.It will be impossible.It is necessary to consider these conditions when selecting parts, but it is only necessary to think about whether to use M.2 or 2.5/3.5 inch, or to prioritize the transfer speed or capacity unit price.It's just, so you won't be particularly bothered by your head.
拡張スロットの間や後方にM.2スロットをずらり並べたレイアウト。1番目と3番目は22110サイズのM.2 SSDをサポートするSerial ATA 3.0は8ポートLooking at the back panel, the MPG grade is equipped with a CMOS clear button and a Flash BIOS button.The MAG grade model has a simple Flash BIOS button, but when it comes to MPG, a solid button and a CMOS clear are added.In addition, the USB terminal is abundant, and the back panel alone has a 10 -port USB terminal.Since the number of PCI Express lanes is limited, it is realized by the USB 3.2 GEN1 compatible hub chip ASMEDIA "ASM1074", but it is highly convenient where it can be handled to some extent without preparing an external USB hub.
PS/2のようなレガシー端子から2.5GbE、Wi-Fi 6、USB 3.2 Gen2 Type-Cといった最新端子までぎっしりと詰まっている豊富なUSB端子の一部はハブチップのASMedia「ASM1074」を用いて実現しているThe network function is equipped with 2.5GBE wired LAN and Wi-Fi 6e wireless LAN.The wired LAN chip is a classic combination of Realtek's "RTL8125B", and the wireless LAN is Intel "Wi-Fi 6e AX210".
定番の2.5GbEチップRealtek「RTL8125B」を採用Intel「Wi-Fi 6E AX210」による無線LANも利用できるThe audio function is Realtek "ALC4080".The ALC4080 uses a USB interface instead of a conventional HD-A connection, and can use a high quality sound up to 32bit/384kHz, which is twice the DAC format, which was a 32-bit/192kHz of 32bit.The audio condenser is made by Japanese chemicon.In addition, the layers are separated by the left and right channels, and a substrate with digital / analog is used, and gold plated is applied to the audio terminal of the back panel as not a MAG grade.
オーディオチップはRealtek「ALC4080」日本ケミコンのオーディオグレードコンデンサを採用オーディオ入出力端子にも金メッキを施しているThe LED illuminations are mounted on the VRM heat sink part and the substrate part below the chips set heat sink (the Carbon logo is also transmitted).Even if it shines, it is an accent -like presence, not as a conventional gaming motherboard.It also has a header for various LEDs, and also supports the addition of LED parts and LED tapes.
LEDはそこまでハデではなくさりげないアクセント的に用いているハデな演出をしたい場合は各部に搭載されたLEDヘッダを利用するFunctions and designs that do not regret are alive in the latest generation "Carbon"!
The MAG series of MSI's AMD X570 refresh motherboard appeared ahead of the MAG series, and this MPG X570S Carbon Max WiFi, "MPG X570S Edge Max Wifi", and "MEG X570S Ace Max" and "MEG X570s UNIFY-X" and "MEG X570s UNIFY-XMAX "appears.From the entry to the entertainer, there is a refresh model option for each layer who wants to assemble a PC with Ryzen.
CARBON has long been a model of the upper middle, both design and performance, and if you get lost, you will definitely choose it.This does not change with MPG X570s Carbon Max WiFi.At present, the semiconductor shortage, the top X570 chipset set, the latest model, the actual selling price is slightly higher than before, but the content is higher.It may be a model that high -end -oriented users should choose.
[Production cooperation: MSI]