AMD's new processor "3rd generation EPYC", which has been enhanced, has appeared as soon as possible
AMD EPYC's third generation "Milan" will be officially announced
The third -generation EPYC processor announced by AMD is a new server market, known for the development code name Milan (Milan, Milan in English).EPYC is the first -generation EPYC, the development code name "Naples" (Naple, English in English) announced in June 2017, and the development code name "ROME" announced in August 2019 (Rome "(Rome).) Although it has evolved properly with the second generation EPYC, Milan is the third generation.
The code names of EPYC are all in the city of Italian, and "Genoa" (Genoa, Genoa, in English), developed by AMD as the next generation of Milan, is an Italian city name.
最高性能のx86 CPUとうたわれる、Milanこと第3世代EPYC（出典：AMD）
The following table summarizes the EPYC specifications in the first, second and third generations.The part represented by red letters in the table is the strengthening point from the previous generation.
表1：AMD EPYC各世代のスペック（AMD社が配布した資料などより筆者作成）As you can see from this, the evolution from the first generation (NAPLES) to the second generation (Rome) was almost a major evolution, almost a major remodeling.The major difference is the change in a mechanism called chiplet architecture, which is equipped with multiple die in a CPU package.
The 1st generation EPYC adopts the first generation chiplet architecture, and has up to four CPU dies of eight core, so that one CPU socket has a maximum of 32 cores.At that time, competitors at the time had a lineup of up to 22 core products per package, so the 32 core per socket had a great impact.One of the reasons why the first generation EPYC has succeeded is that there is no doubt that this chiplet has been adopted.
In the second generation EPYC, the chiplet architecture has evolved into the second generation.In the second -generation chiplet, the CPU and I/O (memory controller or PCI Express controller) are separated, and eight core CPUs and one IOD (I/O Die) are installed in the package.It has been strengthened in shape.As a result, the number of CPU cores per socket has increased to 64, and it supports PCI Express Gen 4.The communication speed of the internal bus called Infinity Fabric was also enhanced from 10.7 GT/second to 18 GT/second.
The number of CPU cores per socket was more than doubled compared to the 28 core of competitors, and was greatly superior in terms of performance.According to these points, the market share has been greatly improved, and according to the AMD's published materials (AMD Corporate Presentation 2021 version), the market share with 1 % of the market share as of 2017 is 2018.It is said to be 5 % a year and 8 % in 2019.